Cypress releases USB 3.0 development platform

Sept. 15, 2014
Cypress Semiconductor Corp. has announced the release of its SuperSpeed Explorer Kit, which is a development platform that enables designers to add USB 3.0 throughput to any system.
 

Cypress Semiconductor Corp. has announced the release of its SuperSpeed Explorer Kit, which is a development platform that enables designers to add USB 3.0 throughput to any system. The $49 kit is based on Cypress’s programmable EZ-USB FX3 USB 3.0 peripheral controller, which is equipped with a General Programmable Interface (GPIF II), which can be programmed in 8-, 16-, and 32-bit configurations. The GPIF II enables the FX3 to communicate directly with application processors, FPGAs, storage media, and image sensors and provides a data transfer rate of up to 400 Megabytes per second. The kit interfaces with external devices via three accessory boards that connect to Aptina image sensors, Altera FPGAs and Xilinx FPGAs, respectively, and also includes an integrated debugger with a standard USB interface to further simplify designs and speed time to market.

To Learn More:

Contact: Cypress Semiconductor Corp.
Headquarters: San Jose, CA, USA
Product: SuperSpeed Explorer Kit
Key Features: Based on EZ-USB FX3 device, which is powered by an ARM9 core with 512 KB of RAM and has a fully programmable GPIF II that can interface with any processor, ASIC, image sensor, or FPGA.

What Cypress says:
View more information on the SuperSpeed Explorer Kit.

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James Carroll

Former VSD Editor James Carroll joined the team 2013.  Carroll covered machine vision and imaging from numerous angles, including application stories, industry news, market updates, and new products. In addition to writing and editing articles, Carroll managed the Innovators Awards program and webcasts.

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