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Industry Trends Highlights 2001 p4 of 7:

• Interchangeable Virtual Instruments Foundation completes incorporation procedure
  AUGUST 24--The Interchangeable Virtual Instruments (IVI) Foundation (San Diego, CA; www.ivifoundation.org), an open consortium of companies that sets software standards for instrument interchangeability, assembled a board of directors and elected officers at a June meeting in Paris, France.
• Demand for ICs, processing equipment in mainland China skyrockets
  AUGUST 21--According to the report Mainland China's Semiconductor and Equipment Markets: A Complete Analysis Of The Technical, Economic, and Political Issues, recently published by The Information Network (New Tripoli, PA; www.theinformationnet.com), a market research company, demand for ICs and equipment in mainland China is exceptionally strong and will continue to exhibit positive growth between 2001 and 2005.
• Europe braced for a softer, gentler crash
  AUGUST 20--Electronic distributors in Europe are anticipating a downturn that will come with less severity than the blows taken by North America and Asia.
• 1394 Trade Association names James Snider executive director
  AUGUST 14--The 1394 Trade Association (TA; Santa Clara, CA) named James Snider as its new executive director. Snider joins the Trade Association from Texas Instruments Inc. to assume a newly created position.
• iSuppli expert lowers semiconductor market predictions for 2001
  AUGUST 14--Greg Sheppard, iSuppli Corp. (El Segundo, CA) vice president for market intelligence services, predicts that commodity semiconductor prices will hit bottom this quarter or next and linger there until the spring of next year.
• Intel-backed PCI spec chosen
  AUGUST 10--The PCI Special Interest Group (PCI-SIG), which is responsible for governing the PCI standard, revealed its choice for a new PCI networking standard--Intel Corp. (Santa Clara, CA;) third-generation I/O interconnect point-to-point linking technology, dubbed Arapahoe, formerly code-named 3GIO.
• June book-to-bill ratio for PWB industry hits 0.74
  JULY 31--The book-to-bill ratio for the US printed wiring board (PWB) industry inched up to 0.74 for June, the IPC-Association of the Connection Electronics Industries reported today.
• Electronic-component orders remain flat
  JULY 27--The Electronic Components, Assemblies & Materials Association (ECA; Arlington, VA; www.ec-central.org/) has reported that orders for electronic components remained flat for the month of June and are expected to remain flat through the summer.
• SEMI book-to-bill ratio increases to 0.54
  JULY 26--The North American book-to-bill ratio for June was 0.54, according to the June 2001 Express Report published by Semiconductor Equipment and Materials International (SEMI; San Jose, CA; www.semi.org).
• Image-sensor market defies tech-industry malaise
  JULY 24--The market for image sensors is booming in terms of both units shipped and revenue, according to Cahners In-Stat Group (Scottsdale, AZ; www.instat.com).

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