Semiconductors Electronics
Semiconductors Electronics news and technical articles from Vision Systems Design magazine. Search Semiconductors Electronics latest and archived news and articles
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SEMICONDUCTOR/ELECTRONICS PRODUCTION: Contact image sensors speed solder-paste printing
Using an automated optical inspection (AOI) tool based on a contact image sensor system from Tichawa Vision, Ersa's Versaprint solder-paste printer provides a 100% in-line inspection at a speed of 9.1 m/sec.
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Aerotech's A3200 industrial computer controls automation systems
The A3200 Automation Controller from Aerotech provides a rugged panel-mount or rack-mount (1U or 4U) computer designed for industrial environments.
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Looking forward to looking back
Any nostalgic feelings for the past may be better put aside with the understanding that the future will only bring with it more exciting technologies, products, and applications.
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Cognex Reports Record First Quarter Revenue
Cognex Corporation (NASDAQ: CGNX) today announced its financial results for the first quarter of 2012. Selected financial data for the quarter ended April 1, 2012, are compared to the first and fourth quarters of 2011 in Table 1 below. "Our results for the first quarter of 2012 were very good and
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New Imaging Technologies image sensor achieves wide dynamic range
New Imaging Technologies' NSC1101-SI is a 640 × 512-pixel wide-dynamic-range (WDR) indium gallium arsenide (InGaAs) image sensor with a 15-µm pixel size.
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UPES students apply for patent on aerial pipeline surveillance vehicle
Dehradun, April 13 -- Two budding engineering students of UPES, Swapna Dilip Rasal of BTech (Aerospace Engineering) and Gane Ravi Kumar of Integrated BTech (Applied Petroleum Engineering) have conceptualised an idea by which a solar powered unmanned aerial vehicle could be deployed for surveillance
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Miniature camera sports autofocusing
Miniature cameras are commonly used in compact imaging systems for security, medical, and industrial environments. They typically consist of an image sensor mounted on a small printed circuit board, with a fixed lens mounted over it.
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Backside-illuminated image sensors: Optimizing manufacturing for a sensitivity payoff
Backside-illuminated image sensors require more precise wafer processing -- uniform extreme wafer thinning, dopant control, epitaxy growth, trench manipulation, etc. -- but the payoff in image quality makes further exploration critical to the advancement of sensors.
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KLA-Tencor's DUV system inspects 450-mm wafers
KLA-Tencor's Surfscan SP3 unpatterned wafer inspection platform employs deep-ultraviolet (DUV) illumination and is designed for extension to the 450-mm wafer size.
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Teledyne DALSA's Piranha NIR camera operates at 34.3-kHz line rate
Teledyne DALSA's Piranha HS NIR 8k camera images in the near-infrared using time delay and integration (TDI) technology for low-light applications.