PCI plug-in inspects BGAs
To inspect ball-grid arrays for defective solder balls, Cognex has developed its BGA inspection package. Designed to examine BGAs at up to 4000 balls/s, the inspection package consists of a PCI-bus vision processor and application-specific machine-vision software. The software includes a Windows-based graphical device description editor for training of ball-grid arrays, including standard plastic BGAs, TAB components, ceramic devices, and those with circular or perimeter ball patterns. Pricing for the BGA package, with software, GUI, PCI processor, and two calibration plates starts at $9500. Cognex, One Vision Drive, Natick, MA 01760-2059; (508) 650-3000; Fax: (508) 650-3333.