AUGUST 27--A system specifically designed for the unique test requirements of circuit-board manufacturers, providing x-ray vision of all inner layers, vias, and hidden tracks for panel sizes up to 55 x 24 in., has been introduced by phoenix x-ray Systems + Services Inc. (Camarillo, CA;www.phoenix-xray.com). Unlike competitive systems that require users to compromise or spend additional money for hardware not used in their application, the XXL ml inspector is specifically designed for multilayer bare-board manufacturers. Intuitive and simple to operate, the system provides fast, repetitive inspection of panels and bare boards, detecting manufacturing errors such as inner layer misalignments, broken tracks, improper via plating, contamination, shorts, and voids. The high magnification and sophisticated software makes process control and failure analysis simple and cost-effective.
The XXL ml inspector is available with an 80- or 100-kV maintenance-free x-ray source. The 6-in. dual-field image intensifier and 100X image magnification are used to detect microscopic details as small as 3 µm. An optional tilt axis up to ±45° provides viewing of the real-time images from all angles, excellent for inspecting multilayer boards with high quantity of inner layers and vias.
The XXL ml inspector is available with a choice of two image-processor software packages, the image optimiser with ml module and image explorer, to further enhance image quality and error detection capabilities of the system. In addition, the system can be equipped with Automated Position Control, offering x-ray image-processor and manipulation automation.
The image optimiser with ml module, running on a Windows NT platform, is phoenix x-ray's most advanced image processing, specific to multilayer analysis. Targeted for use by production operators, technicians and engineers, the image optimiser offers advanced image processing. The user interface is consequently optimized for ease and speed of operation. Features include automated layer alignment, prepreg-voiding analysis, contamination, and via-plating percentages.