MARCH 28--DALSA Corporation (Waterloo, Ontario, Canada; www.dalsa.com) has announced a major order for silicon image-sensor-chip and high-speed digital-camera development services. The order was placed by one of the largest semiconductor capital-equipment manufacturers worldwide, totaling more than $1.9 million. This is in addition to a previous order from a different customer in the same sector, announced in January 2002, totaling more than $1.4 million.
Although all details of the transaction have not been released, the order is for the development of a highly specialized image sensor and digital camera. This combination of sensor and camera will allow elevated speed and accuracy inspecting semiconductor wafers, during manufacture, and associated reticles. This will enable wafer-fabrication facilities to advance their process diagnostic capabilities to increase yield and throughput and ultimately lower costs. This project is expected to be completed over the next 15 months.