August Technology gets repeat order for wafer-level bump-inspection system

FEBRUARY 12--August Technology (Minneapolis, MN; www.augusttech.com) has received a follow-on order for its 300-mm 3Di-8000 wafer- and bump-inspection system from a United States-based integrated-circuit manufacturer.

Feb 12th, 2002

FEBRUARY 12--August Technology (Minneapolis, MN; www.augusttech.com) has received a follow-on order for its 300-mm 3Di-8000 wafer- and bump-inspection system from a United States-based integrated-circuit manufacturer. The system is scheduled for installation at one of the customer's 300-mm production facilities.

Jeff O'Dell, August Technology's chief executive officer, said, "Because the 3Di-8000 uses proprietary Rapid Confocal Sensor (RCS) technology, it can scale to the smaller geometries of emerging advanced packaging and interconnect technologies that many of our customers are developing. While other inspection technologies may run into technical limitations due to decreasing scale and pitch, the RCS has been specifically designed to conquer these challenges."

The 3Di-8000 system incorporates August Technology's 3-D RCS, with proprietary 2-D bump and active-die inspection technologies to provide bump manufacturers with high speed and high accuracy combined in a single bump-inspection solution. The 3Di-8000 is I300I compliant and ready for immediate deployment into advanced, fully automated 300-mm production environments.

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