EV Group (EVG)

EV Group (EVG) is a recognized technology and market leader for wafer processing equipment. We have set worldwide industry standards for aligned wafer bonding as well as resist processing for the MEMS, nanotechnology and semiconductor industries.

Our technological expertise enables customers to develop and successfully commercialize their innovations by providing advanced and proven process solutions from R&D to volume production. A comprehensive range of equipment addressing R&D applications as well as fully automated processes is the result of long term, cooperative relationships with our extensive list of global customers. EVG is a board member of the EMC 3D (www.EMC3D.org) consortium, which is created for the development of cost-effective and manufacturable TSV (Through-Silicon-Via) for 3D chip stacking and MEMS integration. Equipment providers, materials companies and researchers join in an international consortium to address complex integration of TSV 3D chip interconnect. More information can be found at: http://www.evgroup.com