The Helios2 Wide ToF camera integrates Sony’s DepthSense IMX556PLR back-illuminated ToF sensor paired with a wide-angle lens and four wide-angle 850nm VCSEL laser diodes, providing a 108° Field of View (FoV). Helios2 Wide offers a Factory Tough™ IP67 design and a wider 108° x 78° FoV. It is suited for applications with a close working distance and large area of operation such as full-size palletizing.
Smart Cameras combine high-quality image capturing and powerful image processing in an industrial-grade housing, making them the perfect image processing platform for Industry 4.0 and Artificial Intelligence (AI) applications.
Crafting an efficient machine vision system involves numerous factors that impact its performance. While the camera choice is essential, there are other factors that significantly influence the final image.
The core competency of engineers designing machine vision cameras and systems is usually configuring the core camera features to provide the best possible image while meeting size, weight, power budget and other requirements.