Designed for demanding SWIR applications, Hamamatsu’s G16561-0909T InGaAs area image sensor delivers consistent performance where precision matters. A hybrid CMOS ROIC and back illuminated InGaAs architecture supports wide dynamic range, low dark current, and fast readout across a 640 × 512 array. Integrated TE cooling and on chip timing help reduce system complexity and speed development.

Master Bond UV23FLDC-80TK is a moderate viscosity, dual curing, cationic type system. It does not contain any solvents or diluents, has very low shrinkage upon curing, and is not oxygen inhibited. Most noteworthy is its toughness and flexibility, allowing it to withstand rigorous thermal cycling and shock.