A joint venture between the Korean Advanced Institute of Science and Technology’s Center for Integrated Smart Sensors (CISS) and Dual Aperture, Inc. will produce "disruptive smart sensor technology."
CISS will more than double the engineering resources dedicated to commercializing Dual Aperture’s 3D imaging technology. Dual Aperture’s image sensor technology is based on a four-color sensor that is equipped with a dual aperture designed comprised of RGB and infrared pixels, as opposed to the traditional Bayer pattern. The sensor also uses separate apertures for the respective RGB and IR pixels, which allows the capturing of data for two distinct images, one in each spectrum, with different levels of sharpness.
The image sensor technology uses a single, low-power, small form factor sensor and utilizes two sensors to capture 3D information—a technology that both Dual Aperture and CISS believe can disrupt current standards. The sensor, according to a press release, can potentially offer many built-in features to generate real-time 3D depth information via the capture of visual image data in addition to infrared.
Dual Aperture’s small form factor sensor is expected to be suitable for use in medical, biomedical, biological, and security applications to provide gesture tracking, 3D scanning, and HD imaging.
Professor Chong-Min Kyung, CEO of CISS and Professor at KAIST commented on CISS’s choice to collaborate with Silicon Valley start-up Dual Aperture:
"CISS receives collaboration proposals from all over the world and when we examined Dual Aperture's technology, we jumped at the opportunity to build on what we believe to be truly disruptive technology for smart cameras and smart sensors,” he said. “We are extremely excited to work with Dual Aperture for the advancement of RGB-IR technology."
View the press release.
View other articles from our July 2 3D imaging e-newsletter.
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