AAEON releases second generation modular development board
The UP Core Plus modular development board features Intel Apollo Lake processors that enable support for up to four PCIe express lanes. The board can be configured with up to 8 GB of onboard memory and up to 128 GB onboard eMMC storage, features USB 3, DP, and USB OTG connections, and can support wireless and Bluetooth connectivity.
Two 100-pin connectors allow users to add-on docking boards, including AAEON’s Net Plus and UP Vision Plus X, to tailor the UP Core Plus for specific applications. The Net Plus adds four Intel i211 Gigabit LAN ports, a SATA port, and mPCIe slot. The Vision Plus X board adds three Intel Movidius Myriad X VPUs, and a mPCIe slot.
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To Learn More:
Contact: AAEON
Headquarters: Taipei, Taiwan
Product: UP Core Plus modular maker board
Key Features: Apollo Lake processors, up to four PCIe express lanes, 8 GB onboard memory, up to 128 GB onboard eMMC storage; USB 3, DP, and USB OTG connections; wireless and Bluetooth support.
What AAEON says: View more information on the UP Core Plus modular maker board.
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