Nanometrics introduces 300-mm wafer inspection technology

June 24--Nanometrics Inc. (Milpitas, CA; www.nanometrics,), a supplier of integrated and standalone metrology equipment for the semiconductor industry, has launched its NanoUniversal Defect Inspection (UDI) technology for 300-mm wafer processing. The technology is designed to meet the new yield-management requirements that are emerging as the semiconductor industry transitions to 300-mm wafer processing.

TheNanoUDI 9300, the first in the NanoUDI series, features an edge-gripping wafer-handling system that inspects both the front and back sides of the wafer without wafer surface contact. A combination of high efficiency illumination for inspection, high-resolution optics for macro-defect detection, and advanced image processing ensures the detection of 'killer' defects. The image-processing technology coupled with the wafer-handling system performs full wafer inspection throughput in excess of 180 wafers per hour. Full 300-mm wafer inspection means that the metrology tool can provide inspection of 100 percent of the wafer surface with zero edge-exclusion.

Yield management strategies are changing due to both the growing trend towards overall automation and the necessity to detect defects sooner because of the increased value of 300-mm wafers. These strategies include automated macro (defect) inspection (AMI) replacing human visual inspection, traditional automated micro inspection, and the integration of defect inspection technology into wafer-processing systems for early warning detection. NanoUDI technology automatically detects macro and macro defects/particles and is designed for process tool integration. It can be used in nearly every step of the wafer production process 3/4 -- including rough polishing, CMP, layering, photolithography, doping, and die sort and pre-packaging. Common measurement modules ensure complete recipe interchangeability and tool-to-tool matching with NanoNet, a Nanometrics metrology networking software product.