Olympus introduces new software for OmniScan MX flaw detector modules

Oct. 2, 2013
Olympus has releases updated software for the eddy current array (ECA) and bond testing (BT) modules used in the OmniScan MX flaw detector, which is a nondestructive testing instrument suitable for applications in the aerospace and oil and gas industries.

Updated software for the eddy current array (ECA) and bond testing (BT) modules used in the OmniScan MX flaw detector is now available from Olympus. MXE software (ECA and eddy current testing) features a redesigned, intuitive interface and data cursors for integrated data-storage, analysis, and reporting functionalities. MXB software (BT C-scan technology) also features an improved interface and is ideal for honeycomb composite inspections. OmniScan MX, a nondestructive testing instrument, is suitable for applications in the aerospace and oil and gas industries.

To Learn More:

Contact: Olympus
Headquarters
: Waltham, MA, USA
Product:
Updated software for OmniScan MX flaw detector
Key Features: ECT, ECA, and BT C-scan technology, intuitive interface design, easy transition between technologies.

What Olympus says:
View more information on the updated software.

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About the Author

James Carroll

Former VSD Editor James Carroll joined the team 2013.  Carroll covered machine vision and imaging from numerous angles, including application stories, industry news, market updates, and new products. In addition to writing and editing articles, Carroll managed the Innovators Awards program and webcasts.

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