A component of the new x-ray inspection software XI-Pilot V 3.1 is a module that allows for easier evaluation of x-ray images. The feature, called topoVIEW, facilitates this interpretation by construing each single gray value of an x-ray image as a change in materials thickness and density. Thicker materials such as solder, which registers as dark gray values, are displayed on a higher position than thinner PCB materials, which register as light gray values. This method reportedly allows for faults such as lifted leads and shorts to be displayed for easy analysis.
What GOEPEL says:
View a press release on GOEPEL’s topoVIEW.
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