National Instruments hosts NIWeek technical summits, including vision
JUNE 21, 2007--National Instruments (Austin, TX, USA; www.ni.com) has announced four technical summits: graphical system design; RF and wireless communications; sound and vibration; and vision to take place at NIWeek 2007, the company's 13th annual customer and technology conference (Aug. 7--9; Austin Convention Center, Austin, TX, USA). The summits feature targeted keynotes, product technical training, and demonstrations by NI developers and researchers. Attendees can see demonstrations of the summit content on the exhibition floor at corresponding pavilions.
At the graphical system design summit, sponsored by Intel and CMP Media, experts from industry and academia, including Intel, Rensselaer Polytechnic Institute, and the Max Planck Institute, will share ways experienced embedded designers and domain experts without programming knowledge can take advantage of the latest technologies driving embedded design. Attendees can learn how to streamline embedded development through high-level graphical tools and flexible prototyping platforms. Session topics include the business impact of design platform, algorithm engineering, mechatronics, and embedded design case studies.
At the RF and wireless communications summit, industry experts from Freescale Semiconductor, the University of California at San Diego, and the Wi-Fi Alliance will examine the latest advances in development tools for RF, wireless, and communications products. The summit is designed for novice and experienced RF engineers, as well as communications and wireless systems engineers. Session topics include software-defined radio, emerging trends in wireless, reconfigurable test architectures, and production test optimization of wireless devices. The IEEE Communications Society/Signal Processing Society's Wireless Hive Network Symposium will also take place all day Wednesday, Aug. 8, during the summit.
The sound and vibration summit will feature experts from Boeing, SIRIUS Satellite Radio, and the University of Cincinnati. Engineers working in industrial vibration; automotive noise, vibration and harshness; and audio and electroacoustics design can attend presentations by industry and academia experts, as well as hands-on workshops featuring the latest sound and vibration analysis techniques. Session topics include microphone arrays for noise identification; sound intensity measurement and analysis; sound and vibration sensor calibration techniques; advances in prognostics for predictive maintenance; and audio test acceleration with multitone analysis.
Engineers at the vision summit can participate in interactive presentations covering topics such as high-speed image streaming and sensor technologies. The summit features hands-on workshops on subjects such as completing the system, which covers lighting, optics, software, and other facets of machine vision. The summit will feature experts from Edmund Optics, Basler, FLIR, and Sony. Session topics include new edge-detection methods, a vision industry outlook, GigE vision in-depth, and direct-part-mark identification.
More about the NIWeek technical summits is available at www.ni.com/niweek/summits.htm.
