JUNE 24--Robotic Vision Systems Inc. (RVSI; Nashua, NH; www.rvsi.com) has received an order for a WS-series bumped-wafer-inspection system to be delivered to one of Japan's principal semiconductor companies and a major fabricator of 'flip-chip' semiconductors. RVSI's WS-3000 system was selected in a competitive procurement and will be installed during RVSI's fourth fiscal quarter at a facility in Japan.
Bob Michaels, vice president--sales for RVSI's Semiconductor Equipment Group in Hauppauge, NY, said the order represented a critical win with a key customer. "As flip-chip fabrication expands in Japan, customers are recognizing the need for 3-D metrology to properly control the process. This customer evaluated several technological options and selected our WS-3000 as the system that met their exacting requirements for a production-worthy system."
Rather than traditional wire bonds, the newest generation of integrated circuits utilizes microscopic-sized solder or gold "bumps" that are directly deposited on the wafer for electrical connections. RVSI's WS-series improves yield management of bumped wafers and flip-chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system's capabilities include inspection of prereflow and postreflow solder bumps and multi-rocess gold bumps.
RVSI is a leader in vision-based semiconductor inspection and data matrix-based unit-level traceability. Using leading-edge technology, RVSI joins vision-enabled process equipment, high-performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Serving the semiconductor, electronics, aerospace, automotive, pharmaceutical and packaging industries, RVSI holds more than 100 patents in a broad range of technologies.