Prophesee S.A. and Sony collaborate on new design for event-based image sensor

Feb. 26, 2020
Cu-Cu connections make the stacked chip and compact design possible.

Unveiled at the 2020 International Solid-State Circuits Conference in San Francisco in February, the new stacked event-based image sensor from Prophesee S.A. and Sony Corporation stacks a pixel chip on a logic chip to reduce sensor size without affecting performance.

The sensor features 4.86 µm pixel size, 1280 x 720 resolution, >124 dB dynamic range, and combines Sony’s stacked CMOS image sensor technology with Prophesee’s Metavision event-based vision sensing technology. Cu-Cu connections—copper pads that connect the back-illuminated CMOS image sensor top chip with the logic circuit bottom chip—make the stacked chip and compact design possible.

Placing only back-illuminated pixels and a part of N-type MOS transistor on the top chip made the sensor’s high dynamic range possible by allowing the aperture ratio to be enhanced by up to 77%. The new sensor can detect events in light as low as 40 mlx. An output rate of 1.0666 Geps (giga events per second) is made possible by event data compression.

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