Direct Bond Interconnect (DBI) technology from Ziptronix combines a room or low-temperature, non-adhesive covalent bonding technique with integrated high-density interconnect formation. The technology, according to Ziptronix, provides a scalable technology platform for high-performance 3D integrated circuits.
According to the company, the technology features an interconnect pitch of ≤10µm, accommodates 1.5M connections/cm2, and uses standard fab tools and processes (no adhesives, solders, pressure, underfill, or wire bonding required to bond and connect layers of active devices.)
"This license agreement with Sony is an exciting milestone for Ziptronix because it removes any doubt that our patented DBI hybrid bonding technology is both manufacturable and beneficial for high volume applications," said Dan Donabedian, CEO and president of Ziptronix. "We believe it demonstrates that our patented hybrid bonding technology is both enabling and cost effective as compared to stacking with TSVs."
He added, "Sony licensed Ziptronix's ZiBond direct bonding patents in 2011, which we also believe grew their image sensor market share from a few percent to the largest market share in the industry. We expect this new license for Ziptronix's DBI hybrid bonding patents will further contribute to Sony's growth within the industry."
View more information on DBI technology.
Share your vision-related news by contacting James Carroll, Senior Web Editor, Vision Systems Design
To receive news like this in your inbox, click here.