DLP chipset from TI is suitable for use in 3D machine vision and hyperspectral imaging

Consisting of the DLP9000X digital micromirror device (DMD) and the newly available DLPC910 controller, the DLP9000X DLP chipset from Texas Instruments can be used in 3D machine vision and hyperspectral imaging, as well as 3D printing and lithography applications.

Content Dam Vsd En Articles 2015 10 Dlp Chipset From Ti Is Suitable For Use In 3d Machine Vision And Hyperspectral Imaging Leftcolumn Article Headerimage File

Consisting of the DLP9000X digital micromirror device (DMD) and the newly available DLPC910 controller, the DLP9000X DLP chipset from Texas Instruments can be used in3D machine vision and hyperspectral imaging, as well as 3D printing and lithography applications. The chipset features a 2560 x 1600 array, more than 4 million micromirrors, a 7.56 µm micromirror pitch, a 0.9 in. micromirror array diagonal, and a 12° micromirror tilt angle (relative to flat state.) The DLP9000X is optimized for wavelengths from 400 to 700 nm and supports a variety of light sources, including lasers, LEDs, and lamps.

To Learn More:

Contact:Texas Instruments
Headquarters: Dallas, TX, USA
Product:
DLP9000X DLP chipset
Key Features:
 2560 x 1600 array, more than 4 million micromirrors, a 7.56 µm micromirror pitch, a 0.9 in. micromirror array diagonal, and a 12° micromirror tilt angle.

What Texas Instruments says:
View more information on the DLP9000X.

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