Infineon Technologies’ new 3D image sensor chips combine a 3D image sensing pixel array with the digital conversion and control functionality needed to design compact and accurate monocular systems for gesture recognition applications in computers and consumer electronics devices. The 3D image sensor embeds a time-of-flight pixel-matrix from pmdtechnologies that features “suppression of background illumination,” which improves the sensor chips’ range for indoor and outdoor operations.
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Headquarters: Neubiberg, Germany
Product: 3D image sensor chips
Key Features: Photosensitive pixel array, sophisticated control logic, digital interfaces with analog-to-digital converters, digital outputs.
What Infineon Technologies says:
View more information on the 3D image sensor chips.
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