FEBRUARY 5, 2008--The fourth Japanese Forum on Thermography, organized by Cedip Infrared Systems (Croissy-Beaubourg, France; www.cedip-infrared.com), attracted more than 70 participants from leading academic institutions and companies from the automotive, electronics, steel-working, and photonics sectors. Held in Yokagawa, Japan, on January 25, 2008, the annual meeting was organized to provide a forum to enable cross-fertilization of ideas, to discuss new instrumental developments, and to allow users to pose technical questions relating to IR thermography and related NDT technologies.
Dr. Sakagami of Osaka University discussed techniques using IR cameras and how to avoid measurement inaccuracies. Mr. Shibuya of JFE Techno-Research and Mr. Irie of Matsushita Electric presented application-based talks presented from a user's point of view. A popular talk was given by Mr. Inoue of Technical Institute of Tokyo on the subject of reverse analysis of stress images using a new hybrid stress analysis simulation program. Mr. P Bremond of Cedip Infrared Systems introduced the latest developments in IR thermography systems and discussed applications where the advances offered benefits. His colleague Mr. A Dillenz gave a presentation on UTvis, OTvis, and PTvis and the applications of these new NDT technologies.
Cedip Infrared Systems, a FLIR Systems company, offers a range of high-performance infrared imaging cameras and systems incorporating the latest technology in optics, IR FPA detectors, electronic hardware, and software.
