Texas Instruments has announced the availability of the DLP9000 and DLP6500 chipsets, which are digital micromirror devices that are designed for 3D machine vision applications. The DLP9000 (pictured) offers a 4 MPixel, 2560 x 1600 micromirror array with a 7.6 µm micromirror pitch and 0.9 in. micromirror array diagonal. DLP9000 chipsets are designed for use in the 400 to 700 nm wavelength range. The DLP6500—which is available in the DLP6500FYE and DLP6500FLQ—offers a 2 MPixel, 1920 x 1080 micromirror array with a 7.6 µm micromirror pitch and 0.65 in. micromirror array diagonal. DLP6500FYE chip sets are designed for use in the 400 to 700 nm wavelength range, while the DLP6500FLQ is designed for use in the 420 to 700 nm wavelength range.
The chipsets feature two configurable I/O triggers for synchronizing with cameras or sensors and support data transfer up to 40 Gbps. In addition, the light-steering chipsets are suitable for use in industrial, medical, and scientific applications.
To Learn More:
Contact:Texas Instruments
Headquarters: Dallas, TX, USA
Product: DLP chipsets for 3D machine vision
Key Features: 2 MPixel micromirror with 7.6 µm micromirror pitch (DLP6500), 4 MPixel micromirror with 7.6 µm micromirror pitch (DLP9000), 40 Gbps data transfer rate.
What Texas Instruments says:
View more information on the DLP chipsets.
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