FLIR to showcase miniature Lepton thermal imaging camera core at SPIE DSS 2014

FLIR Systems, Inc. will showcase its Lepton thermal imaging camera core that is about the size and weight of a conventional CMOS cell phone camera module, at SPIE DSS 2014 from May 5-9 in Baltimore, MD.

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FLIR Systems, Inc. will showcase its Lepton thermal imaging camera core that is about the size and weight of a conventional CMOS cell phone camera module, at SPIE DSS 2014 from May 5-9 in Baltimore, MD. The Lepton features an 80 x 60 uncooled VOx microbolometer array with a pixel size of 17 µm x 17 µm and an exportable frame rate of 9 Hz. Lepton is designed for integration into third party products such as smartphones, tablets, diagnostic tools, automobiles, and OEM applications. The 8.5 x 8.5 x 5.9 mm fixed focus camera features a spectral range of 8 µm to 14 µm, 50° horizon field of view, and thermal sensitivity of <50 mK. Lepton utilizes wafer-level detector packaging, wafer-level micro-optics, and a custom integrated circuit that supports all camera functions on a single integrated low power chip. The FLIR ONE, which transforms an iPhone into an infrared imaging camera, was developed with the Lepton camera core.

SPIE DSS 2014 booth number: 709, 881

To Learn More:

Contact:FLIR
Headquarters: Wilsonville, OR, USA
Product:
FLIR Lepton
Key Features:80 x 60 uncooled VOx microbolometer array, 9 Hz frame rate, 17 µm x 17 µm pixel size, spectral range of 8 µm to 14 µm.

What FLIR says:

View more information on the FLIR Lepton.

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