DECEMBER 3, 2009--Infrared photodetector producer IRnova (Kista, Sweden; www.ir-nova.se) is now offering its FlipChip hybridization service to other detector manufacturers. The company has shipped thousands of quantum well infrared photodetectors (QWIPs) to worldwide customers.
The hybridization stage, when the read-out IC and the detector are mounted together, is an essential step to reach high operability (number of working pixels) and high reliability in detector manufacturing.
Prior to the FlipChip process, small indium bumps are deposited on the wafers, then the wafers are diced. The read-out IC and the detector die are aligned together and hybridized in FlipChip bonder equipment.
IRnova has shipped detectors with 100% operability and has received requests from several detector manufacturers and R&D laboratories with various technologies to use its capabilities as a subcontractor for this production stage. IRnova is able to handle various types of technologies with wafer sizes from 50 to 200 mm.
--Posted by Vision Systems Design, www.vision-systems.com
