DECEMBER 22, 2009--The latest version of the Micro thermal imaging system for semiconductor failure analysis includes a new thermal imaging camera with 320 x 240-pixel element uncooled detector and 0.05 degrees Celsius sensitivity, 20-µm microscopic lens, wide angle lens, and 16-bit digital Camera Link interface. Additional applications include calculating thermal resistance, measuring junction temperature, and identifying die bond defects. A complete system includes thermal imaging camera, tower computer and monitor, mounting platform, vertical camera stage, x-y table, thermal chuck with controller, and I/O relay module.
OptoTherm
Sewickley, PA, USA
www.optotherm.com
-- Posted by Carrie Meadows, Vision Systems Design, www.vision-systems.com
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PRESS RELEASE
Camera upgrade for Micro thermal imaging system
Sewickley, PA - The latest version of the Micro thermal imaging system for semiconductor failure analysis includes a new thermal imaging camera with 320x240 element uncooled detector and 0.05 deg C sensitivity, 20 µm microscopic lens, wide angle lens, and 16 bit digital Camera Link interface.
As electronic devices continue to decrease in size, heat generation and thermal dissipation become increasingly important. Micro can measure and display the temperature distribution over the surface of semiconductor devices, enabling quick detection of hot areas which can decrease efficiency and frequently lead to early failure. Additional applications include calculating thermal resistance, measuring junction temperature, and identifying die bond defects.
A complete Micro system includes thermal imaging camera, tower computer and monitor, mounting platform, vertical camera stage, xy table, thermal chuck with controller, and I/O relay module.
OptoTherm, Inc.
2591 Wexford-Bayne Road, Suite 304
Sewickley, PA 15143
Ph: 724-940-7600
Fax: 724-940-7611
Website: www.optotherm.com
Email: [email protected]
