Machine vision targets semiconductor inspection

Combining sophisticated lighting, multiple cameras, and custom hardware allows semiconductor wafers to be rapidly inspected.

Wafer bumping is a fast-growing method of packaging silicon for high-density and high-frequency applications. The bumping process is constantly being improved and cost is decreasing, making these interconnect methods more popular. To enable this technology, semiconductor-inspection systems are now incorporating sophisticated machine-vision lighting, camera systems, and high-speed image-processing systems to ensure the integrity of the devices.

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