Combining sophisticated lighting, multiple cameras, and custom hardware allows semiconductor wafers to be rapidly inspected.
Combining sophisticated lighting, multiple cameras, and custom hardware allows semiconductor wafers to be rapidly inspected.
Wafer bumping is a fast-growing method of packaging silicon for high-density and high-frequency applications. The bumping process is constantly being improved and cost is decreasing, making these interconnect methods more popular. To enable this technology, semiconductor-inspection systems are now incorporating sophisticated machine-vision lighting, camera systems, and high-speed image-processing systems to ensure the integrity of the devices.
