Thermal-imaging camera supports microscopy

Micro thermal-imaging system includes a new camera with greater sensitivity, 16-bit digital Camera Link interface, and a microscopic lens with 2-µm spatial resolution. Micro is used to detect shorts and defects on semiconductor devices and small circuit boards. It can also measure junction temperature, identify die-bonding defects, and measure packaged die thermal resistance.

Micro thermal-imaging system includes a new camera with greater sensitivity, 16-bit digital Camera Link interface, and a microscopic lens with 2-µm spatial resolution. Micro is used to detect shorts and defects on semiconductor devices and small circuit boards. It can also measure junction temperature, identify die-bonding defects, and measure packaged die thermal resistance. Its optical mounting table provides a sturdy platform with vibration isolation on which to perform sensitive testing. The thermal stage provides both heating and cooling for precise device temperature control.
OptoTherm
Sewickley, PA, USA
www.optotherm.com

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