LWIR image sensor from Teledyne DALSA now available in wafer-level package

Teledyne DALSA has introduced wafer-level packaging to its longwave infrared (LWIR) imaging platform.

Content Dam Vsd En Articles 2017 09 Lwir Image Sensor From Teledyne Dalsa Now Available In Wafer Level Package Leftcolumn Article Headerimage File

Teledyne DALSAhas introduced wafer-level packaging to its long wave infrared(LWIR) imaging platform.

The company’s wafer-level packaged Vanadium Oxide (VOx) microbolometer is a 320 x 240 pixel device with 17 µm pixel size, and is available to original equipment manufacturers (OEM). The LWIR image sensor covers the 8 to 14 µm wavelength and is fully configurable with the Calibir camera and core platform from Teledyne DALSA. This new wafer-level packaging, according to Teledyne DALSA, gives the company the ability to "dramatically alter the traditional price-performance tradeoff."

With the process, Teledyne DALSA can bond multiple 200 mm wafers in a 3D stack that eliminates the need for external chip packaging, which can account for 75% or more of a device cost. By stacking a cap wafer using vacuum-sealing technology onto a CMOS readout circuit populated with Vox pixels, Teledyne DALSA suggests that it can deliver smaller, lighter devices with increased performance and lower costs.

Along with the wafer-level packaging, Teledyne DALSA will display its real-time LWIR-visible image fusion OEM sub-system—which is configured from the Calibir camera and core platform—at the Defence & Security Equipment International Show (DSEI) UK from September 12-15.

View more information on the wafer-level packaging.
View a press release on the announcement.

Share your vision-related news by contacting James Carroll, Senior Web Editor, Vision Systems Design

To receive news like this in your inbox,
click here.

Join our LinkedIn group | Like us on Facebook | Follow us on Twitter

More in Cameras & Accessories