Heat sink sockets from Andon to be shown at LASER World of Photonics 2017

June 7, 2017
At Laser World of Photonics 2017 in Munich from June 26-29, photonics components supplier EURECA Messtechnik will showcase the patented Heat Sink Socket line from Andon Electronics.

At Laser World of Photonics 2017 in Munich from June 26-29, photonics components supplier EURECA Messtechnik will showcase the patented Heat Sink Socket line from Andon Electronics. Combining the benefits of a heat sink and a socket, this solution enables users of image sensors, optoelectronic sensors, and other devices used on PC boards to reduce device heat and noise while avoiding: 1) device damage from exposure to high temperature solder, ESD, and cleaning solutions, 2) cracked solder joints and associated intermittency from differences in thermal expansion between the device and PCB, 3) labor and PC board damage from de-soldering a faulty device, and 4) production delays from holding up PCB assembly until the devices arrive.

LASER World of Photonics 2017 booth number: Hall A, Booth 319

To Learn More:

Contact:Andon Electronics Corporation
Headquarters
: Lincoln, RI, USA
Product: patented Heat Sink Socket line
Key Features: Dissipates heat and reduces noise, insulated socket with aluminum heat sink body.

What Andon says:
View more information on the Heat Sink Sockets.

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James Carroll

Since joining the team 2013, James covered machine vision and imaging from numerous angles, including application stories, industry news, market updates, and new products. In addition to writing and editing articles for each issue of the magazine, James managed the Innovators Awards program and webcasts.


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