Chipset and development kit from Melexis enables 3D Time of Flight applications
Consisting of the MLX75023 1/3” Time of Flight image sensor and the MLX75123 companion chip, the Time of Flight chipset from Melexis enables the development of 3D Time of Flight solutions.
Consisting of the MLX75023 1/3” Time of Flight image sensor and the MLX75123 companion chip, the Time of Flight chipset from Melexis enables the development of 3DTime of Flight solutions. The MLX75023 features a 320 x 240 DepthSense ToF pixel array with a spectral response of 800 – 900 nm. The sensor is capable of 600 fps in raw image frame rate and features 63 dB linear dynamic range. The MLX75123 companion chip directly interfaces the sensor integrated circuit to a host MCU and provides readout of data from the sensor.
A modular approach taken in the design means that the sensor can be changed or upgraded without having to change product architecture, which enables the design of multiple solutions with the same base design. Applications that can be developed with the chipset, according to Melexis, include gesture recognition, driver monitoring and occupant detection in automotive applications, as well industrial automation and smart city applications.
To Learn More:
Headquarters: Tessenderlo, Belgium
Product: Time of Flight chipset and development kit
Key Features: MLX75023 sensor (320 x 240 DepthSense ToF pixel array), MLX75123 companion chip (four high-speed ADCs, digital sensor control for ToF sensor).
What Melexis says:
View more information on the chipset.
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