DALSA receives $1.6 million camera-development contract

JULY 13--DALSA Corporation (Waterloo, ON, Canada;www.dalsa.com) has received a $1.6 million camera-development contract from a leading manufacturer of semiconductor wafer-inspection systems. The project will be completed over the next 15 months, at which time the product will be available for significant follow-on production for the customer.

Under the terms of the contract, DALSA will develop high-performance digital cameras that will be used to inspect semiconductor wafers at extremely high speeds and low light levels.