DALSA receives custom contracts totaling $2.5 million
April 6, 2004
APRIL 6--DALSA Corporation (Waterloo, ON, Canada; www.dalsa.com) has announced that its Application Specific Contracts group has received two custom camera contracts totaling $2.5 million.
APRIL 6--DALSA Corporation (Waterloo, ON, Canada; www.dalsa.com) has announced that its Application Specific Contracts group has received two custom camera contracts totaling $2.5 million. The contracts, from two separate customers, are for the development of high-performance electronic cameras for semiconductor-wafer inspection and remote sensing. Both contracts have the potential for follow-on production orders.
For the first customer, a leading semiconductor capital-equipment manufacturer, DALSA will produce a custom image sensor and digital camera that will be used to inspect semiconductor wafers at extremely high speeds and low light levels, enabling semiconductor-wafer manufacturers to maintain better quality control, improve yield, and reduce costs. The project will be completed over the next 20 months.
The second contract, which will be completed within six months, is for a custom camera that will be "the eyes" of a sophisticated imaging system for remote sensing. Remote sensing is often used for monitoring crops, comparing urban and rural land use, tracking icebergs, detecting oil spills, and making maps and nautical charts.
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