Technology trends

Hewlett-Packard Co. (Santa Barbara, CA; www.hp.com/ go/logicanalyzer) has added Web-server capability to its HP 16600A and 16700A logic-analysis systems. This capability allows test-instrument users to access these analyzers over the Internet or through an intranet using Version 4.0 or higher of Microsoft Internet Explorer or Netscape Communicator browsers.

Mar 1st, 1999

Technology trends

Hewlett-Packard Co. (Santa Barbara, CA; www.hp.com/ go/logicanalyzer) has added Web-server capability to its HP 16600A and 16700A logic-analysis systems. This capability allows test-instrument users to access these analyzers over the Internet or through an intranet using Version 4.0 or higher of Microsoft Internet Explorer or Netscape Communicator browsers.

Integrating Identicator Technology`s fingerprint extraction and matching software, Unisys Corp. (Blue Bell, PA; www.marketplace.unisys.com/sp-security) has released its SP BioPin fingerprint-imaging technology that verifies a computer user by a fingerprint instead of a password. If the scanned fingerprint at the computer matches the user`s fingerprint stored in the authentication database, system access is granted and the user can log on.

At its research center, Seagate Technology Inc. (Bloomington, MN; www.seagate.com) has achieved a 16-Gbit/sq in. areal density, more than 250% the areal density of present disk drives, by using merged read-write giant magneto-resistive heads and ultra smooth cobalt-alloy media. This technology can also transfer data at rates to 214 Mbit/s using commercial channels at an error rate of less than 1 in 10 million.

To obtain faster data-transfer rates and extend the length of connecting cables, Matrox Imaging (Dorval, Quebec, Canada) has added low-voltage differential signaling support in its Genesis scalable vision processors and Genesis-LC frame grabbers for interfacing to digital output cameras. Both boards will continue to offer support for the RS-422 and TTL digital signaling standards.

Tower Semiconductor Ltd. (Migdal Haemek, Israel) has developed a stitching process that enables the manufacturing of ultrahigh-resolution CMOS image sensors. This process allows the physical merger of multiple design structures onto a wafer during the photolithography procedure, thereby creating a single CIS containing millions of pixels and avoiding the size limitation imposed by the exposure field of lithography steppers.

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