Teledyne FLIR Releases IR Development Kit

Teledyne FLIR has introduced a new development kit for developing infrared thermal systems, the Boson+ IQ. Based on the Qualcomm Dragonwing QCS8550 platform, the kit comes with Boson and Prism software SDKs. It has 3 MIPI interfaces for the Boson+ thermal camera and additional cameras. It can deliver up to 50 TOPS and features multicore architecture for inference, general compute, and computational imaging. It achieves 640 x 512 resolution and 1280 x 1024 super resolution at 30 to 60 Hz.  

The Boson+ IQ development kit is especially designed to enable integrators to more easily  develop AI-powered thermal infrared sensing at the edge, for applications requiring some autonomy, such as aerial drones and robotics.

To Learn More:

Contact: Teledyne FLIR

Headquarters: Richmond, BC, Can

Product: Boson+IQ development kit 

Key Features: 3 MIPI interfaces, up to 50 TOPS output, 640 x 512 resolution and 1280 x 1024 super resolution at 30 to 60Hz

What Teledyne FLIR says: View more information on Boson+IQ Development Kit

Share your vision-related news by contacting Linda Wilson, Editor in Chief, Vision Systems Design.