Optimal adhesion is achieved in bond line thicknesses of 0.001-0.003 inch, and it can cure rapidly with a minimum intensity of 20-40 milliwatts/cm2 using a UV light source emitting at a wavelength of 320-365 nm. The material can also be cured in sections up to 0.125 inch thick under appropriate conditions, making it suitable for bonding, sealing, coating, and encapsulation.
UV15-7HP has a strong performance profile, featuring a tensile strength of 6,000-7,000 psi and a tensile modulus of 250,000-300,000 psi at room temperature. This toughened system resists thermal cycling and offers significant elongation of 5-10%. It is an electrically insulative material with a volume resistivity greater than 1014 ohm-cm. Optically clear with a refractive index of 1.54 at 589 nm, it is not oxygen inhibited and contains no solvents or diluents.