August Technology receives two repeat orders for 3Di inspection

SEPTEMBER 6--August Technology (Minneapolis, MN; www.augusttech.com) has received two repeat orders for 3Di Series wafer- and bump-inspection systems.

Sep 6th, 2002

SEPTEMBER 6--August Technology (Minneapolis, MN; www.augusttech.com) has received two repeat orders for 3Di Series wafer- and bump-inspection systems. The orders are from a Taiwanese subcontractor and a leading US-based integrated device manufacturer (IDM). "These repeat orders are a direct result of the 3Di Series' ability to solve the unique challenges of our customers' applications," said Greg Stark, 3Di Series product manager. "The flexibility of our 3Di systems provides customers with the ability to quickly inspect both whole and sawn wafers at all wafer sizes, including 300 mm, as well as to perform both 2-D and 3-D inspection on gold, copper, and solder-bumping technologies."

"As microelectronic device manufacturers continue to rapidly adopt wafer level bumping, the need for automated bump inspection continues to grow," explained Jeff O'Dell, August Technology chairman and chief executive officer. "For some device manufacturers inspection is critical for process understanding and improvement, for others automated inspection serves as assurance that only good devices are shipped to their customers. In both cases, it is the information provided by automated inspection that our customers need, and the 3Di continues to demonstrate its ability to provide them with this critical process information."

According to industry research by Dataquest, the number of bumped wafers is expected to grow by 288% over the next four years. The 3Di Series enables bumped-device manufacturers to lower their time to market and cost of manufacturing. Incorporating August Technology's patent-pending three-dimensional Rapid Confocal Sensor, with proprietary two-dimensional bump and active die-inspection technologies, the 3Di Series provides bump manufacturers with high speed and high accuracy combined in a single bump-inspection solution.

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