OCTOBER 23--Robotic Vision Systems Inc. (RVSI; Canton, MA; www.rvsi.com) has received a $2.2 million order for 3-D substrate-inspection systems from a major Asian material supplier. The multisystem order is the first of its kind for RVSI and represents an important new market for the company.
Substrates are part of advanced integrated circuit packages such as microprocessors. Substrates typically contain microscopic solder "bumps" that must be mated to bumps or bump locations on a semiconductor chip to which the substrate will be bonded. 3-D inspections on substrates include measurement of bump volume, height, area, and position. Inspection also provides quality assurance of bumps after test and aids in development of flip-chip packaging.
Including this new substrate inspection system, which is part of RVSI's LS-series, RVSI now provides 3-D inspection of semiconductors at three crucial stages of the manufacturing process where metrology is of paramount concern. RVSI provides the industry's premier system for the inspection of assembled semiconductor packages through its LS-series lead scanners. RVSI's WS-series of inspection tools facilitates wafer-level inspection of flip chip and bumped wafers.
This newest member of the LS-series extends RVSI's 3-D expertise to substrate inspection. Using RVSI's MicroMap laser technology, the new product provides high levels of 3-D inspection, acquiring several thousand surface profiles per second without relying on any moving parts inside the laser sensor. The compact design of the LS-series is easily deployed at many semiconductor and electronics manufacturing process steps.
