IPC releases Component Identification Training and Reference Guide
DECEMBER 13, 2007--IPC--Association Connecting Electronics Industries (Bannockburn, IL, USA; www.ipc.org), a global trade association of 2500 member companies representing all facets of the electronics interconnect industry, has announced the release of IPC DRM-18H, Component Identification Training & Reference Guide. This comprehensive component-identification resource for electronics assembly operators and inspectors contains color photographs, computer graphics, schematic symbols, and detailed descriptions of more than 50 common through-hole and surface-mount components used in electronics assembly today.
The new Revision H contains updated information on small shrink outline package (SSOP), thin small outline package (TSOP), quad flat pack (QFP), low-profile quad flat pack (LQFP), plastic quad flat package (PQFP), leadless chip carrier (LCC), quad flat no-lead (QFN), and ball-grid-array (BGA) related packages, including all the variations within those groups. New components include dual flat no-lead (DFN), quad flat no-lead (QFN) multi-row, package on package (PoP), chip scale package (CSP), chip on board (COB), bare die, and flip chip. In addition, a new section has been added that stresses the dangers of cross contamination when using lead-free components and assemblies.
The terminology section of the guide has quick facts on polarity, orientation, lead styles and component reference designators. The reading component values section includes easy-to-use color code charts for resistors and inductors, as well as charts for reading numbered capacitor data.
