JANUARY 15--YESTech (San Clemente, CA; www.yestechinc.com), a provider of yield-enhancement solutions, will debut its YTV-2080 high-speed automated optical inspection (AOI) system at APEX 2004, the show for the electronics manufacturing and test industry. The YTV breakthrough color megapixel Thin Camera technology provides high-speed PCB inspection with defect coverage. The YTV inspects for solder and lead defects, component presence and position, correct part, polarity, and paste.
YESTech will also showcase its YTX-3000 high-resolution x-ray inspection system at APEX. Based on the company's proprietary machine-vision software, which includes real-time sharpening, the YTX-3000 offers fully automated inspection of BGA and flip-chip devices, solder joint quality, die attach, bond wires, and electronic assembly verification.
The YTV-2080 and YTX-3000 systems enable electronics manufacturers and semiconductor packagers to reduce costs, improve quality, and increase throughput. Both offer quick setup, allowing operators to create a complete inspection program in less than 45 minutes. Utilizing a standard package library, the systems simplify training and insure program portability across manufacturing lines. The YTV is available with up to eight cameras--four top down and four side-viewing. Thin Camera technology integrates color, normalized correlation, and rule-based algorithms, for complete inspection coverage with an low false failure rate.
The YTX-3000 features Windows XP-based software and a flexible, maintenance-free configuration. Its x-ray tube provides a 5-μm spot size for high resolution and superior image quality. The system is available with a four or five-axis manipulator with 18 x 20-in. (457 x 508 mm) x-y travel for samples weighing up to 5 lb. Stepper-motor drives provide a wide range of motion, from ultraslow use at high magnifications to high speed for travel over longer distances. All systems come with a control module and programmable motion for automated inspection.
