Neptec introduces intelligence in three dimensions

April 18, 2006
APRIL 18--Neptec Design Group (Ottawa, ON, Canada; www.neptec.com) has announced its latest advancement in 3-D sensor systems.

APRIL 18--Neptec Design Group (Ottawa, ON, Canada; www.neptec.com) has announced its latest advancement in 3-D sensor systems. Intelligence in Three Dimensions, or 3Di, reduces the time and bandwidth needed to process 3-D data. The smart technology can be used for any application where timely, effective decision making is of critical importance such as military, security, robotics, and manufacturing applications.

Neptec, a NASA prime contractor, has been building mission-critical machine-vision systems for the shuttle and space station programs for more than 10 years. Now, its next generation of sensors will be smarter and more efficient. 3Di offers the ability to process 3-D data at the sensor level, providing the end user with only the necessary information. Because the sensor only reports on the useful information and none of the extraneous data, bandwidth use and time spent analyzing data are dramatically reduced.

By reducing the amount of unessential data being processed, Neptec's 3Di can provide an analyzed result in real time and requires significantly less bandwidth than traditional systems. In some cases the reduction in bandwidth could be a factor of 100 or even 1000.

Neptec will be introducing its 3Di technology at SPIE Defense and Security Symposium in Orlando from April 17 to 21 at booth No. 1333. In addition, Neptec will be providing presentations and industry insight on its 3Di technology and the Laser Camera System used by NASA.

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