Leica LDS3300 C, part of the company's LDS series, combines simultaneous micro and macro defect detection for all 300-mm-wafer applications. The macro module of the Leica LDS3300 C system automatically captures a full-color image of an entire wafer surface.
Leica LDS3300 C, part of the company's LDS series, combines simultaneous micro and macro defect detection for all 300-mm-wafer applications. The macro module of the Leica LDS3300 C system automatically captures a full-color image of an entire wafer surface. This image is compared as die-to-die or die-to-reference information. Differences are considered as defects and are compared to an image library of known classified defect groups. Leica Microsystems Wetzlar, Germany www.leica-microsystems.com
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