Feinfocus and Xradia develop x-ray inspection technology

NOVEMBER 22--FEINFOCUS (Stamford, CT;www.feinfocus.com), a COMET business unit and global supplier of high-resolution x-ray inspection systems, is now offering the microXCT defect-detection system for the semiconductor-packaging and medical-device industries with Xradia, developer of ultrahigh-resolution x-ray imaging systems for 3-D tomography. The microXCT uses nondestructive 3-D tomography to view the complete structure of advanced packages at full resolution. Unlike conventional x-ray imaging systems that lose resolution during tomography, the microXCT scans packages in 3-D at full resolution.

Multiple resolution modes allow the user to easily switch from navigation at 30 μm to high-resolution defect localization and characterization at 1 μm. The automated 3-D tomography device features virtual cross-section capability, thus eliminating the need for costly and time-consuming sample preparation.

The system typically images and constructs a high-resolution 3-D volumetric dataset with up to 1000 cross-sectional slices in 15 minutes. The compact design makes the system ideal for any manufacturing environment.