Motorola to transfer 0.13-μm process to Tower Semiconductor
SEPTEMBER 27-The Motorola Inc. Semiconductor Products Sector will transfer its copper 0.13--μm CMOS process technology to Tower Semiconductor Ltd. (Migdal Hamek, Israel) as part of a technology-transfer deal.
SEPTEMBER 27-The Motorola Inc. Semiconductor Products Sector will transfer its copper 0.13--μm CMOS process technology to Tower Semiconductor Ltd. (Migdal Hamek, Israel) as part of a technology-transfer deal. The partners said the deal calls for Motorola to supply its HiperMOS7 technology to Tower's Fab 2 fabrication facility. Product prototyping in the process by Tower's customers could begin as early as the first quarter of 2003, the companies said.
Yoav Nissan-Cohen, Tower's cochief executive, said the agreement allows Tower to advance its technology offerings by another generation. "We now have access to industry-leading 0.13-μm process technology, as well as the benefit of Motorola's experience with copper interconnect technology. This will enable us to accelerate our support of new and existing customers."
Tower said it intends to use HiperMOS7 technology for its analog, digital, and mixed-signal processes, as well as for its proprietary CMOS image-sensor and Microflash technologies. The HiperMOS7 technology transfer is scheduled to be completed by the fourth quarter of 2003.
The agreement also calls for the partners to develop technology to provide compatibility with the widest possible range of standard design tools and services. The technology is expected to be developed at a Motorola facility concurrent with the HiperMOS7 transfer.
The relationship between Tower and Motorola dates back to 1994. In 1998, Motorola transferred its 0.6- and 0.8-μm analog and mixed-signal processes to Tower's Fab 1 facility.