SEPTEMBER 26--Analog Devices Inc. (ADI; San Jose, CA) has expanded its data-converter product families with the introduction of chip-scale packaging (CSP) technology, which increases the design flexibility and reduces the package size by up to 87% without compromising superior performance levels. ADI has initially applied its new streamlined design to select high-speed and precision data-converter products. Other parts, including amplifiers, power-management devices, and switches/muxes will soon be available in CSP as well.
The package design is especially useful for applications such as ultrasound and imaging, where multiple signal channels rapidly increase the number of components needed. Furthermore, the performance and small footprint are equally appropriate for customer premises communications equipment, such as set-top boxes, wireless modems, and LMDS transceivers, where cost and size are key drivers. Other significant benefits include increased pin compatibility. CSP technology allows the placement of ICs, regardless of the physical configuration of the die, into standard square packages. This makes it easier to provide pin compatibility across families and across generations of product, giving customers simple migration paths for modifying the end-system.
There is also increased flexibility. Implementing high-performance converters in application-specific integrated circuits (ASICs) can be very risky, and, in many cases, desired performance levels cannot be attained. CSP converters provide designers with the option to leave the converter outside of the ASIC, rather than integrating it, thereby achieving the desired performance level without paying a real-estate premium.
For a complete listing of Analog Devices' parts available in chip-scale packaging, see www.analog.com/csp.