Agilent Technologies and Inter Action to promote CMOS sensor market

June 18, 2003
JUNE 18--Agilent Technologies Inc. (Palo Alto, CA; www.agilent.com) and Inter Action Corp. (Yokohama, Japan; www.inter-action.co.jp) announced a joint low-cost test platform for CMOS image-sensor chips used in a variety of consumer, commercial, and industrial applications.

JUNE 18--Agilent Technologies Inc. (Palo Alto, CA; www.agilent.com) and Inter Action Corp. (Yokohama, Japan; www.inter-action.co.jp) announced a joint low-cost test platform for CMOS image sensor chips used in a variety of consumer, commercial, and industrial applications, including camera phones, digital cameras, and automotive applications. "Production of image sensors is expected to grow by 18.4% CAGR (compound annual growth rate) through 2007, when production volume is projected to reach 380 million units," said Jay Srivatsa, principal analyst, consumer electronics, at iSuppli (www.isuppli.com). "During this period, growth rates of CMOS sensors will be far higher than CCD sensors. CMOS sensors will post a CAGR of 42% while CCD sensors will grow only by 6% CAGR."

The new Agilent 93000 CMOS Image Sensor test platform incorporates a light source (illuminator) and image-processing capability manufactured by Inter Action and designed exclusively for the Agilent 93000 SOC Series test system. The new product combines the Agilent and Inter Action technologies, which is designed to reduce cost of test for this growing market by providing higher test throughput and increased yield.

The Agilent 93000 CMOS Image Sensor test solution uses a software-controlled illuminator, advanced frame grabbing, image processing, and analysis techniques to provide fast test results. The system's four parallel, dedicated, high-speed PCs quickly capture image-sensor data, process the information, and send results to the Agilent 93000's workstation for display. Everything, including an image-processing card in the test head and a highly uniform illuminator, is fully integrated into the 93000's architecture, allowing easy control via the 93000's software. In addition, proven multi-site testing can be done both on-wafer and for packaged parts.

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