JULY 29--FEINFOCUS (Garbsen, Germany; www.feinfocus.com) is partnering with DaimlerChrysler SIM Co., a research center in Shanghai, China (www.dcsimtech.com). FEINFOCUS and DaimlerChrysler SIM's relationship is based upon a mutual interest in the rising emergence of China's electronics-packaging developments in recent years. DaimlerChrysler's range of industrial customers and partners is expected to benefit from x-ray inspection and analysis capabilities.
DaimlerChrysler SIM recently installed an FXS-160.23 x-ray inspection system in its testing laboratories to support its research-and-development efforts in automotive electronics and electronics packaging. The FXS-160.23 system features BGA and void-calculation analysis, board size capabilities of 390 x 370 mm (16 x 15 in.), and a total magnification of up to 2600X. Numerous options are available to increase system manipulation, image chain, and image-processing functionality, depending on the scope of applications for which the system is intended.
DaimlerChrysler SIM Technology focuses on automotive electronics development and prototyping, as well as research, training, consulting, testing, and failure-analysis services on electronic packaging. In the Americas, FEINFOCUS maintains headquarters in Stamford, CT, and a Technical Resource Center in San Jose, CA.
