MAY 2--FeinFocus USA (Stamford, CT; www.feinfocus.com) and Palomar Technologies (Vista, CA; www.palomartechnologies.com) are teaming up to address the manufacturing challenges of the optoelectronics, MEMS/MOEMS, and RF components markets. Palomar's process development and prototyping services will use the FeinFocus FOX-160.25MFT x-ray inspection system for the inspection of advanced components, materials, and packaging technologies.
The companies will also publish joint technical papers on their findings with regards to process development, testing, and manufacturing of optoelectronics and micromechanical components and assemblies. This relationship will enable the real-time inspection of complex assemblies that include chip-on-board, bond wires, BGA, µBGA, and flip-chip components, as well as other applications where precise measurement is required. The FeinFocus FOX inspection system offers submicron defect detection and small focal spot size.
