X-Scan Imaging's TDI camera reduces scattered radiation
The XTH12848 x-ray time-delay and integration (TDI) camera series from X-Scan Imaging is engineered for x-ray, gamma-ray, betatron, and neutron radiographic imaging.
The XTH12848 x-ray time-delay and integration (TDI) camera series is engineered for x-ray, gamma-ray, betatron, and neutron radiographic imaging. TDI technology enables fan-beam collimation, which reduces scattered radiation during high-energy full-field radiographic imaging. The camera is available with a CCD sensor having a 48-µm pixel pitch and 128 TDI stages. Sensor resolutions range from 2048 to 6144 pixels in various lengths from 4 to 12 in. Software-configurable aperture settings optimize sensitivity and focus. Binning modes permit imaging at lower resolutions. The camera system is compatible with energy sources ranging from 250 kV to 15 MeV. Systems include the camera head, Camera Link and GigE Vision interfaces, power adapter, cabling, and proprietary software development kit (SDK).
X-Scan Imaging Corp.
San Jose, CA, USA
-- Posted by Vision Systems Design
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X-ray Time-Delay-Integration (TDI) Camera Improves Speed & Resolution for High-Energy In-line Radiographic Imaging
When the TDI sensor is synchronized to the object motion, an image with significantly greater resolution at x-ray power is achieved.
San Jose, CA -- X-Scan Imaging Corporation, announces the XTH12848 X-ray TDI Camera series designed for high-energy x-ray, gamma-ray, betatron and neutron radiographic imaging applications. When imaging steel objects and other common materials using photon energies above 200 KeV, Compton scattering typically occurs, thereby increasing noise and reducing SNRs/CNRs in radiographic images. Anti-scatter grids reduce scattered radiation, but also attenuate the primary x-rays and, furthermore, become ineffective at higher photon energies. TDI technology enables the use of fan-beam collimation which dramatically reduces scattered radiation that is unavoidable in high-energy full-field radiographic imaging. The TDI method is based on the concept of accumulating multiple line-scans which provides significantly increased responsivity, greater scanning speeds, decreased noise and increased SNRs/CNRs when compared to other technologies, including single-scan Linear Diode Array (LDA). In addition, with its higher sensitivity TDI technology enables higher resolution and/or reduced x-ray power requirements at conventional inspection speeds.
The XTH12848 TDI Series Camera is available with a CCD sensor having a 48 µm pixel pitch and 128 TDI stages. Sensor resolutions range from 2048 to 6144 pixels in various lengths from 4 inches to 12 inches. Software-configurable aperture settings allow for optimization of sensitivity and focus. Software-configurable binning modes 2x2, 4x4, 8x8, etc. permit imaging at lower resolutions. Other key functional specifications include: 3 MHz CCD pixel clock, 10 KHz TDI line rate, 16 bit dynamic operating range and bi-directional readout. The camera system is compatible with a full range of energy sources ranging from 250 KV to 15 MeV.
According to Dr. Chinlee Wang, X-Scan’s President and CEO “With scatter-free TDI imaging, our new XTH Series Cameras offer superior high-energy image quality -- often not attainable with full-field or LDA imaging technologies.”
All XTH12848 Camera models incorporate X-Scans’ CCD silicon imaging detector array designed for visible wavelength and x-ray sensitive applications. A scintillator layer converts x-ray photons into visible light that is captured by the linear array of photodiodes. The specific scintillator material and range of thickness can be selected for optimizing both detector sensitivity and image resolution and is typically determined by the application and energy source. A unique off-axis, fiber optic plate design protects the CCD sensor from direct radiation and extends the camera operating lifetime.
The single quantity prices for the XTH X-ray cameras range from $23,450 to $79,950, including camera head, Camera Link and GigE Vision interfaces, power adapter, cabling, and X-Scan’s proprietary Software Development Kit (SDK) including software drivers, intuitive application programming interface (API), and example code software that enables rapid development of non-destructive testing (NDT) inspection and other x-ray imaging applications. Current availability is 4 weeks to 16 weeks. Scintillator material and custom CCD sensor geometries can be ordered for special performance and energy range requirements. Contact the factory for special pricing and availability.
Applications for the X-Scan TDI Camera include in-line Non-Destructive Testing (NDT) e.g., continuous pipe weld inspection and other imaging where use of high energy sources, higher inspection rates and higher quality imaging is of particular interest.
X-Scan Imaging Corporation is a foremost designer and leading domestic manufacturer of high-performance line-scan x-ray specific imagers and camera systems using proprietary CMOS and CCD TDI technology. For further information, contact Dr. Lin-Bo Yang, Director, X-Scan Imaging Corp., 70 Bonaventura Dr., San Jose, CA 95134. Tel: 408-432-9888; Fax: 408-432-9889; E-mail: firstname.lastname@example.org.
SOURCE: X-Scan Imaging