AOI system inspects solder paste in 2-D
Jun 27-- GOEPEL electronic GmbH (07745 Jena, Germany) has introduced an automated inspection system called "OptiCon Paste Inspector 2-D" for the two-dimensional checking of solder-paste print for positioning and missing or blurred solder paste.
Jun 27-- GOEPEL electronic GmbH (07745 Jena, Germany;www.goepel.com) has introduced another automated inspection system called "OptiCon Paste Inspector 2-D" for the two-dimensional checking of solder-paste print for position and missing or blurred solder paste.
The core of the system is a matrix-camera with a shadow-free illumination unit. Solder paste is recognized by threshold and detection algorithms that visually separate solder paste, printed-circuit board (PCB) background, and solder pads. Different materials and solder-stop lacquer do not affect the test results. The system can inspect PCBs with dimensions of up to 400 x 430 mm.
A user-friendly interface aids in system programming, permits the manual starting of particular test steps, and, via a configuration menu, determines defaults for pad groups or for individual pads such as the maximum and minimum height of the solder paste. Users can read in scan ranges (test steps) via CAD data import or determine them automatically through manual specifications. Particular test steps can also be deleted, which is useful for the solder-paste inspection of large pads. Faulty solder-paste coating is indicated immediately after the inspection, as well as graphical presentations of the test range and test results.